Low profile DC-DC power converter for 3-D electronics assembly

A 130 W/in/sup 3/ 48Vdc-to-3.3Vdc power converter has been developed for an avionics distributed power system. This converter employs advanced packaging based on the GE-Lockheed Martin High Density Interconnect technology and new ultra low profile magnetics to provide a 150 mil high form factor that is consistent with high density 3D electronics packaging.