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3D stacking using bump-less process for sub 10 µm pitches
3D stacking using bump-less process for sub 10 µm pitches
2016
Jaber Derakhshandeh
Inge De Preter
C. Gerets
Lin Hou
Nancy Heylen
Eric Beyne
Gerald Beyer
John Slabbekoorn
Vikas Dubey
Anne Jourdain
Goedele Potoms
Fumihiro Inoue
Geraldine Jamieson
Kevin Vandersmissen
Samuel Suhard
Tomas Webers
Giovanni Capuz
Teng Wang
Kenneth June Rebibis
Andy Miller
Keywords:
Electronic engineering
Composite material
Materials science
Stacking
Correction
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