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Electromigration
Related Fields
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Dielectric
Electrical resistance and conductance
Failure analysis
Activation energy
Temperature
Chip
Scanning electron microscope
Resistance
Grain boundary
Current density
Electric field
Joule heating
Very-large-scale integration
Copper
Flip chip
Mass transfer
Stress
Integrated circuit
Intermetallic
Microstructure
Reliability
Metallizing
Aluminium
Thin film
Software Testing
Parent Topic:
Electronic engineering
,
Metallurgy
,
Engineering
,
Electrical engineering
,
Electronic design automation
Top Authors:
Paul S Ho
K N Tu
Chih Chen
C K Hu
Carl V Thompson
Ellen D Williams
Y C Chan
Dimitrios Maroudas
Shinji Yokogawa
Youngchang Joo
Yumi Kakuhara
Masumi Saka
Kristof Croes
Kirsten Weidezaage
Chenming Hu
H Ceric
Ronald G Filippi
C R Kao
J R Lloyd
Ehrenfried Zschech
Cher Ming Tan
Kuniko Kikuta
E E Glickman
A Scorzoni
K Maex
Siegfried Selberherr
Youngbae Park
Yoshihiro Hayashi
Tarik Omer Ogurtani
M A Meyer
M Rauf Gungor
Paul L Mceuen
Takamaro Kikkawa
Gianluca Piccinini
P J Rous
M Ohring
J W Morris
A S Oates
Paul R Besser
Christine Hauriege
Cemal Basaran
P Justison
Abhay N Pasupathy
L De Schepper
A T Wu
S W Liang
Katsuaki Suganuma
D D Brown
R E Hummel
E Liniger
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