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Larissa Djomeni

European Automobile Manufacturers Association

4

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Focused ion beam time-of-flight secondary ion mass spectroscopy tomography of through-silicon vias for 3D integration

2016 Journal of Vacuum Science & Technology. B. Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena
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Study of low temperature MOCVD deposition of TiN barrier layer for copper diffusion in high aspect ratio through silicon vias

2014 Microelectronic Engineering
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Analysis of High Aspect Ratio through Silicon via (TSV) Diffusion and Stress Impact Profile during 3D Advanced Integration

2014
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Low temperature MOCVD TiN barrier deposition for high aspect ratio TSVs : A solution for 3D integration

2013
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