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Yukihisa Hiroyama
Yukihisa Hiroyama
Hitachi
Wire bonding
Grain boundary diffusion coefficient
Engineering
Electroplating
Electrolytic process
3
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2
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Electroless Ni/Pd/Au Plating for High Reliable Gold Wire Bonding with Electronic Devices for Space Applications
2017
Yukihisa Hiroyama
yukihisa hiroyama
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Electroless Ni/Pd/Au plating for semiconductor package substrates-effect of gold plating combinations on gold wire bonding reliability
2010
ICSJ | CPMT Symposium Japan
Yoshinori Ejiri
Takehisa Sakurai
Yoshinori Arayama
Yoshiaki Tsubomatsu
Shuuichi Hatakeyama
Shigeharu Arike
Yukihisa Hiroyama
Kiyoshi Hasegawa
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多層プリント配線板の製造方法、内層回路基板の処理方法及び多層プリント配線板、内層回路基板
2005
Kiyoshi Hasegawa
Yukihisa Hiroyama
Kazutoshi Nakayama
Kazuhiko Sakayori
Toru Yajima
kazutosi nakayama
kazuhiko saka juu
yukihisa hiroyama
tooru yazima
kiyosi hasegawa
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