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Xiaotong Chang

Northwestern Polytechnical University

5

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Mechanical Behavior of Lead-free Solder at High Temperatures and High Strain Rates

2021 ICEPT | International Conference on Electronic Packaging Technology
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Effect of Surface Stress on Indentation Response of Elastic-Plastic Materials

2021 ICEPT | International Conference on Electronic Packaging Technology
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Effect of Temperature on the Fatigue Damage of SAC305 Solder

2021 ICEPT | International Conference on Electronic Packaging Technology
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Force reconstruction based on the union of singular spectral analysis and regularization method

2019 Mechanics Based Design of Structures and Machines
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Study on solving the ill-posed problem of force load reconstruction

2019 Journal of Sound and Vibration
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Citations (11)