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P. S. Andry
P. S. Andry
IBM
Electronic engineering
Polymer
Copper
Engineering
Wafer
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Investigations of Cu bond structures and demonstration of a wafer-level 3D integration scheme with W TSVs
2010
VLSIT | Symposium on VLSI Technology
Kuan-Neng Chen
Cyril Cabral
S.-H. Lee
P. S. Andry
Jian-Qiang Lu
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