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Akihiko Ohsaki
Akihiko Ohsaki
Mitsubishi Electric
Copper interconnect
Electronic engineering
Interconnection
Tin
Physics
5
Papers
30
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Highly reliable interconnect integration of Cu and low-k organic polymer based on fine CD controls
2001
IITC | International Interconnect Technology Conference
Y. Nishioka
S. Tomohisa
Y Toyoda
T. Fukada
T. Satake
M. Matsuura
S. Domae
Akihiko Ohsaki
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Hybrid Cu and Al interconnects for high-performance system LSI
1999
Hiroshi Kawashima
Motoshige Igarashi
Akihiko Harada
Hiroyuki Amishiro
Noboru Morimoto
Akihiko Ohsaki
Keiichi Higasitani
Hideaki Arima
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The best combination of aluminum and copper interconnects for a high performance 0.18 /spl mu/m CMOS logic device
1998
IEDM | International Electron Devices Meeting
Motoshige Igarashi
Akihiko Harada
Hiroyuki Amishiro
Hiroshi Kawashima
Y. Kusumi
T. Saito
Akihiko Ohsaki
T Mori
T. Fukada
Y Toyoda
Keiichi Higashitani
Hideaki Arima
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Formation of TiN/Ti adhesion layers by collimated sputtering
1995
Electronics and Communications in Japan Part Ii-electronics
Akihiko Ohsaki
Masahiko Fujisawa
Hideo Kotani
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Simultaneous formation of TiN and TiSi2 by lamp annealing in NH3 ambient and its application to diffusion barriers
1987
Journal of Applied Physics
T. Okamoto
Masahiro Shimizu
Akihiko Ohsaki
Youji Mashiko
Katsuhiro Tsukamoto
Takayuki Matsukawa
S. Nagao
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Citations (30)
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