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Grant Villavicencio
Grant Villavicencio
Materials science
Electronic engineering
Interposer
Interconnection
Art
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2024
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Challenges of Scalable 2.5D IC Assembly
2015
Journal of microelectronics and electronic packaging
Liang Wang
Charles G. Woychik
Guilian Gao
Grant Villavicencio
Scott McGrath
Hong Shen
Sitaram Arkalgud
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Development of 2.5D and 3D IC Fabrication and Assembly Technologies
2015
Guilian Gao
Hong Sheng
Sangil Lee
B. Lee
Scott McGrath
Liang Wang
Charles G. Woychik
Cyprian Emeka Uzoh
Grant Villavicencio
Roseann Alatorre
Sitaram Arkalgud
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High-brightness LEDs of big chip size on multi-layer interconnects with optimized thermal dissipation and optical performance
2014
Liang Wang
Gabe Guevara
Grant Villavicencio
Roseann Alatorre
Hala Shaba
Rey Co
Eric Tosaya
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Interconnexion électrique pour puce empilée dans une configuration en zigzag
2010
Reynaldo Co
Grant Villavicencio
Jeffrey S. Leal
Simon J.S. Mcelrea
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Procédé de séparation de puce à semi-conducteur
2009
Reynaldo Co
DeAnn Eileen Melcher
Weiping Pan
Grant Villavicencio
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