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Soon-Wook Kim
Soon-Wook Kim
IMEC
Materials science
Electronic engineering
Composite material
Wafer
Wire bonding
5
Papers
28
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Direct Bonding of low Temperature Heterogeneous Dielectrics
2019
ECTC | Electronic Components and Technology Conference
Serena Iacovo
Lan Peng
Alain Phommahaxay
Fumihiro Inoue
P. Verdonck
Soon-Wook Kim
Erik Sleeckx
Andy Miller
Gerald Beyer
Eric Beyne
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Citations (5)
Novel Failure Analysis Techniques for 1.8 µm Pitch Wafer-to-Wafer Bonding
2018
ECTC | Electronic Components and Technology Conference
Christian Schmidt
Lorenz Lechner
Ingrid De Wolf
Soon-Wook Kim
Eric Beyne
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Development of multi-stack dielectric wafer bonding
2016
ICEPT | International Conference on Electronic Packaging Technology
Lan Peng
Soon-Wook Kim
Fumihiro Inoue
Teng Wang
Alain Phommahaxay
P. Verdonck
Anne Jourdain
Joeri De Vos
E. Sleeckx
Herbert Struyf
Andy Miller
Gerald Beyer
Eric Beyne
Mike Soules
Stefan Lutter
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Citations (6)
3D-SoC integration utilizing high accuracy wafer level bonding
2016
EPTC | Electronics Packaging Technology Conference
Lan Peng
Soon-Wook Kim
Nancy Heylen
Maik Reichardt
Florian Kurz
Thomas Wagenleitner
E. Sleeckx
Herbert Struyf
Kenneth June Rebibis
Andy Miller
Gerald Beyer
Eric Beyne
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Citations (3)
W2W permanent stacking for 3D system integration
2014
EPTC | Electronics Packaging Technology Conference
Lan Peng
Soon-Wook Kim
Michael Soules
Markus Gabriel
Margarete Zoberbier
E. Sleeckx
Herbert Struyf
Andy Miller
Eric Beyne
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Citations (14)
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