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S. Tetreault
S. Tetreault
IBM
Electronic engineering
Chip
Finite element method
Failure rate
Mechanics
2
Papers
2
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0
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The projection of the incidence of dielectric cracking during chip joining with lead free solder bumps
2016
IRPS | International Reliability Physics Symposium
Timothy M. Shaw
X-H Liu
Ekta Misra
David L. Questad
Griselda Bonilla
Thomas A. Wassick
Hosadurga Shobha
K. Smith
Gordon C. Osborne
D. Kioussis
J. Wright
R. Bisson
I. Paquin
Mark C. H. Lamorey
S.S. Bouchard
S. Tetreault
David B. Stone
Christopher D. Muzzy
Brian R. Sundlof
Timothy H. Daubenspeck
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The strength of BEOL structures fabricated using low K materials and its impact on CPI failures
2015
IIRW | International Integrated Reliability Workshop
Timothy M. Shaw
X-H Liu
Ekta Misra
David L. Questad
Griselda Bonilla
Thomas A. Wassick
Mark C. H. Lamorey
Hosadurga Shobha
Gordon C. Osborne
D. Kioussis
J. Wright
R. Bisson
I. Paquin
S.S. Bouchard
S. Tetreault
David B. Stone
Christopher D. Muzzy
Brian R. Sundlof
Timothy H. Daubenspeck
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Citations (2)
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