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Jason Lee Frankel
Jason Lee Frankel
IBM
Computer science
Computer engineering
Electronic engineering
Systems engineering
Automotive engineering
2
Papers
28
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Inspection / Metrology Evaluation of Fine Pitch Test Vehicles for Advanced Packages
2019
ICEP | International Conference on Electronics Packaging
Feng Xue
Joe Zou
Cindy Han
Charles L. Reynolds
Thomas A. Wassick
Glenn A. Pomerantz
Jason Lee Frankel
Ravi Bonam
Charles Woychik
Masahiro Tsuriya
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MCM technology and design for the S/390 G5 system
1999
Ibm Journal of Research and Development
George A. Katopis
Wiren D. Becker
Toufie R. Mazzawy
Howard H. Smith
Charles Vakirtzis
S. Kuppinger
Bhupindra Singh
Phillip C. Lin
John Bartells
Gregory V. Kihlmire
Panangattur N. Venkatachalam
H. Stoller
Jason Lee Frankel
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Citations (28)
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