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S. Tismer
S. Tismer
Fraunhofer Society
Electronic engineering
Optoelectronics
Thin film
Bond strength
Physics
4
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18
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オフラインロックイン解析を用いた磁場と電流密度イメージング【Powered by NICT】
2016
Microelectronics Reliability
M. Kögel
Frank Altmann
S. Tismer
Sebastian Brand
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Laser-welded fused silica substrates using a luminescent fresnoite-based sealant
2016
Optics and Laser Technology
A. de Pablos-Martín
G. Benndorf
S. Tismer
M. Mittag
Andreas Cismak
Michael Lorenz
Marius Grundmann
Th. Höche
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Laser soldering of sapphire substrates using a BaTiAl6O12 thin-film glass sealant
2016
Optics and Laser Technology
A. de Pablos-Martín
S. Tismer
G. Benndorf
M. Mittag
Michael Lorenz
Marius Grundmann
Th. Höche
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Citations (7)
Magnetic field and current density imaging using off-line lock-in analysis
2016
Microelectronics Reliability
M. Kögel
Frank Altmann
S. Tismer
Sebastian Brand
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Citations (1)
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