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Bruce Hsu
Bruce Hsu
Silicon
Directional solidification
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Materials science
Metallurgy
5
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61
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Board Level Reliability of Thinner Stacking Chips Package with Through Silicon Via Interposer
2018
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
Wen Shan Tsai
Bruce Hsu
Fred Chang
Yun Long Huang
Joe Lin
C.F. Lin
C. Key Chung
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Numerical analysis of thermal stress and dislocation density distributions in large size multi-crystalline silicon ingots during the seeded growth process
2017
Journal of Crystal Growth
Thi Hoai Thu Nguyen
Jyh-Chen Chen
Chieh Hu
Chun-Hung Chen
Yen Hao Huang
Huang-Wei Lin
Andy Yu
Bruce Hsu
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Citations (8)
Numerical Study of the Thermal and Flow Fields during the Growth Process of 800 kg and 1600 kg Silicon Feedstock
2017
Thi Hoai Thu Nguyen
Jyh-Chen Chen
Chieh Hu
Chun-Hung Chen
Yen Hao Huang
Huang-Wei Lin
Andy Yu
Bruce Hsu
Michael Yang
Ray Yang
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Citations (3)
N-type high-performance multicrystalline and mono-like silicon wafers with lifetimes above 2 ms
2017
Japanese Journal of Applied Physics
Sieu Pheng Phang
Hang Cheong Sio
Chia-Fu Yang
C. W. Lan
Yu-Min Yang
Andy Yu
Bruce Hsu
Chuck Wen-Ching Hsu
Daniel Macdonald
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The emergence of high-performance multi-crystalline silicon in photovoltaics
2017
Journal of Crystal Growth
C. W. Lan
A. Lan
C.F. Yang
Hung-Pin Hsu
M. Yang
Andy Yu
Bruce Hsu
W.C. Hsu
A Yang
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Citations (47)
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