Old Web
English
Sign In
Acemap
>
authorDetail
>
Yew Wing Leong
Yew Wing Leong
Composite material
Materials science
Wafer-level packaging
Thermal copper pillar bump
Soldering
1
Papers
0
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (1)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Forming a Vertical Interconnect Structure Using Dry Film Processing for Fan Out Wafer Level Packaging
2017
ECTC | Electronic Components and Technology Conference
Yew Wing Leong
Hsiang-Yao Hsiao
Soon Wee Ho
Boon Long Lau
Huamao Lin
Show All
Source
Cite
Save
Citations (0)
1