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Kazumi Kojima
Kazumi Kojima
Electronic engineering
Interconnection
Three-dimensional integrated circuit
Stacking
Materials science
5
Papers
111
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3D Chip Stacking Utilizing 20 μm-Pitch Micro Cu Bump Interconnection
2005
Journal of Japan Institute of Electronics Packaging
Kazumasa Tanida
Mitsuo Umemoto
Kazumi Kojima
Kenji Takahashi
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Citations (1)
High-performance vertical interconnection for high-density 3D chip stacking package
2004
ECTC | Electronic Components and Technology Conference
Mitsuo Umemoto
Kazumasa Tanida
Yoshihiko Nemoto
Masataka Hoshino
Kazumi Kojima
Yuji Shirai
Kenji Takahashi
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Citations (65)
3-Dimensional Chip Stacking for High- Density Electronic Packaging
2003
Kenji Takahashi
Kazumasa Tanida
Mitsuo Umemoto
Kazumi Kojima
Masakazu Ishino
Manabu Bonkohara
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Citations (3)
Development of advanced 3D chip stacking technology with ultra-fine interconnection
2001
ECTC | Electronic Components and Technology Conference
Kenji Takahashi
Masataka Hoshino
Hitoshi Yonemura
Manabu Tomisaka
Masahiro Sunohara
Michinobu Tanioka
Tomotoshi Sato
Kazumi Kojima
Hiroshi Terao
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Citations (42)
Pulverization or granulation of amine oxide
1980
Shinichi Akimoto
Kazumi Kojima
Michita Shibata
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1