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Philippe Lombard
Philippe Lombard
Claude Bernard University Lyon 1
Molded interconnect device
Wireless power transfer
Electrical engineering
Omnidirectional antenna
Planar
5
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10
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Investigation of 3D printed polymer-based heat dissipator for GaN transistors
2021
EPE | European Conference on Power Electronics and Applications
Tony Gerges
Alexandre Marie
Thilini Wickramasinghe
Philippe Lombard
Marie Leveque
Stéphane Lips
Valérie Sartre
Bruno Allard
Michel Cabrera
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3D Plastronics for Smartly Integrated Magnetic Resonance Imaging Coils
2020
Frontiers in Physics
Tony Gerges
V. Semet
Philippe Lombard
Sophie Gaillard
Michel Cabrera
Simon A. Lambert
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Omni-Directional Inductive Wireless Power Transfer with 3D MID inductors
2019
WPTC | IEEE Wireless Power Transfer Conference
Kamotesov Sergkei
Philippe Lombard
V. Semet
Bruno Allard
Maël Moguedet
Michel Cabrera
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The Potential of 3D-MID Technology for Omnidirectional Inductive Wireless Power Transfer
2018
Kamotesov Sergkei
Philippe Lombard
V. Semet
Bruno Allard
Maël Moguedet
Michel Cabrera
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Omnidirectional inductive wireless charging of a 3D receiver cube inside a box
2018
WPTC | IEEE Wireless Power Transfer Conference
Sergkei Kamotesov
Philippe Lombard
V. Semet
Bruno Allard
Maël Moguedet
Michel Cabrera
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Citations (3)
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