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Jim-Wein Lin
Jim-Wein Lin
Materials science
Polymer
Laser ablation
Composite material
Electronic engineering
3
Papers
11
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0
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2024
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Optimization of Laser Release Process for Throughput Enhancement of Fan-Out Wafer-Level Packaging
2018
ECTC | Electronic Components and Technology Conference
Chia-Hsin Lee
Jay Su
Xiao Liu
Qi Wu
Jim-Wein Lin
Puru Lin
Cheng-Ta Ko
Yu-Hua Chen
Wen-Wei Shen
Tzu-Ying Kou
Shin-Yi Huang
Yu-Min Lin
Kuan-Neng Chen
Ang-Ying Lin
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Citations (9)
Study on low temperature Cu bonding and temporary bond/de-bond for RDL-first fan-out panel level package
2017
Cheng-Ta Ko
Kai-Ming Yang
Jim-Wein Lin
Chih-Lun Wang
Tzu-Chieh Chou
Yu-Tao Yang
Ting-Yang Yu
Yu-Hua Chen
Kuan-Neng Chen
Tzyy-Jang Tseng
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Flex circuit depaneling in thin film polymer using dry etching technology
2016
IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
Jim-Wein Lin
D.-S. Liu
Chen Hao Lin
Chih-Lun Wang
Jui Tang Chen
Cheng-Hsiung Wang
Chi-Hai Kuo
Kai-Ming Yang
Yin-Po Hung
Cheng-Ta Ko
Yu-Hua Chen
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