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Kenichi Oohashi
Kenichi Oohashi
Hitachi
Composite material
Materials science
Thermal expansion
Package on package
Substrate (chemistry)
4
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Challenge to zero CTE and small cure shrinkage organic substrate core material for thin CSP package
2016
ICEP | International Conference on Electronics Packaging
Norihiko Sakamoto
Shin Takanezawa
Shinji Tsuchikawa
Masaaki Takekoshi
Kenichi Oohashi
Koji Morita
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New Super-Low CTE (0.7 ppm/K) Core Material for Next Generation Thin CSP
2015
Electronic Components and Technology Conference
Yukio Nakamura
Kenichi Oohashi
Koji Morita
Shuji Nomoto
Takayuki Suzuki
Shin Takanezawa
Shinji Tsuchikawa
Masaaki Takekoshi
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Challenge to zero CTE and lower shrinkage organic substrate material for thin CSP package
2015
International Conference on Electronics Packaging
Shintaro Hashimoto
Shin Takanezawa
Shinji Tsuchikawa
Masaaki Takekoshi
Kenichi Oohashi
Koji Morita
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Newly developed ultralow CTE materials for thinner PKG applications
2013
APM | International Symposium on Advanced Packaging Materials
Kenichi Oohashi
Masato Miyatake
Hikari Murai
Shin Takanezawa
Shinji Tsuchikawa
Masaaki Takekoshi
Tomohiko Kotake
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