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Timothy Ryan Rude
Timothy Ryan Rude
Thermal grease
Soldering
Heat sink
Thermal resistance
Composite material
5
Papers
31
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Procédé de liaison de composants électroniques à basse température
2008
Heerden David Van
Timothy Ryan Rude
Ramzi Vincent
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Structures de matériau composite réactif avec une protection vis-à-vis d'une décharge électrostatique et leurs applications
2006
Timothy P. Weihs
Etienne Besnoin
Ramzi Vincent
Somasundaram Valliappan
Ellen M. Heian
Heerden David Van
Timothy Ryan Rude
Omar M. Knio
Ronald Spraker
Yuping Lin
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Room temperature soldering of microelectronic components for enhanced thermal performance
2005
EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Jai S. Subramanian
Peter Rodgers
Jesse Newson
Timothy Ryan Rude
Zhaojuan He
Etienne Besnoin
Timothy P. Weihs
Valerie Eveloy
Michael Pecht
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Citations (13)
A tenfold reduction in interface thermal resistance for heat sink mounting
2004
Journal of microelectronics and electronic packaging
D. Van Heerden
Timothy Ryan Rude
Jesse Newson
J. He.
Etienne Besnoin
Omar M. Knio
Timothy P. Weihs
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Thermal behavior of a soldered Cu-Si interface
2004
SEMI-THERM | Semiconductor Thermal Measurement and Management Symposium
D. Van Heerden
Timothy Ryan Rude
Jesse Newson
Omar M. Knio
Timothy P. Weihs
D.W. Gailus
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Citations (11)
1