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Hari Venugopalan
Hari Venugopalan
Materials science
Composite material
Adhesive
System in package
Electronic engineering
4
Papers
10
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Boxer: Preventing fraud by scanning credit cards.
2020
SECURITY | USENIX Security Symposium
Zain ul Abi Din
Hari Venugopalan
Jaime Park
Andy Li
Weisu Yin
Haohui Mai
Yong Jae Lee
Steven Liu
Samuel T. King
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Citations (3)
UVC LEDs Enhance Chromatography Applications
2016
Genetic Engineering & Biotechnology News
Hari Venugopalan
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Citations (1)
Novel anisotropic conductive adhesive for 3D stacking and lead-free PCB packaging A review
2011
S. Manian Ramkumar
Hari Venugopalan
Kumar Khanna
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Novel anisotropic conductive adhesive for 3D stacking and lead-free PCB packaging — A review
2011
ECTC | Electronic Components and Technology Conference
S. Manian Ramkumar
Hari Venugopalan
Kumar Khanna
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Citations (3)
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