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Sam S. Garcia
Sam S. Garcia
Freescale Semiconductor
Materials science
Electronic engineering
Interconnection
Copper
Metallurgy
5
Papers
40
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Through-Silicon Via Fill for 3D Interconnect Applications
2009
Varughese Mathew
Ritwik Chatterjee
Robert E. Jones
Sam S. Garcia
Eddie Acosta
Zhihong Huang
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Citations (3)
Three dimensional chip stacking using a wafer-to-wafer integration
2007
IITC | International Interconnect Technology Conference
Ritwik Chatterjee
M. Fayolle
P. Leduc
Scott K. Pozder
B. Jones
Eddie Acosta
Barbara Charlet
T. Enot
M. Heitzmann
M. Zussy
A. Roman
O. Louveau
Sylvain Maitrejean
D. Louis
N. Kernevez
Nicolas Sillon
G. Passemard
V. Po
Varughese Mathew
Sam S. Garcia
Terry G. Sparks
Zhihong Huang
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Citations (34)
Selective Formation of Micropads for 3D Interconnect Applications
2007
Varughese Mathew
Ritwik Chatterjee
Sam S. Garcia
Eddie Acosta
Robert E. Jones
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Citations (1)
Electroless Plated CoWB and COWPB Films for Copper Cap Applications
2006
Varughese Mathew
Lynne M. Michaelson
Sam S. Garcia
Eddie Acosta
Dennis Werho
Richard. Gregory
Zhi-Xiong Jiang
Kiwoon Kim
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Citations (1)
Characterization of electroless plated CoWB barrier films
2003
Varughese Mathew
Ritwik Chatterjee
Sam S. Garcia
Lynne Svedberg
Zhi-xiong Jiang
Richard. Gregory
Kun-Ho Lie
Katie Yu
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Citations (1)
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