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Lei Jin
Lei Jin
Honeywell
Materials science
Copper interconnect
Chemical-mechanical planarization
Dielectric
Polishing
3
Papers
5
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0
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Matieres durcissables a faible temperature pour applications optiques
2005
Victor Lu
Lei Jin
Arlene J. Suedmeyer
Paul G. Apen
Peter Alfred Smith
Jinghong Chen
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Organosiloxane based bottom antireflective coating for 193nm lithography
2003
Bo Li
Kim Do
Jason Stuck
Songyuan Xie
Roger Y. Leung
Tiffany Nguyen
Jaswinder Gill
Lei Jin
Wenya Fan
Shilpa Thanawala
Faith Zhou
Nancy Iwamoto
Emma Brouk
Joseph Kennedy
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Nanoglass/sup TM/ E copper damascene processing for etch, clean, and CMP
2001
IITC | International Interconnect Technology Conference
F. Zhang
O. Leonte
Z. J. Chen
Lei Jin
J.A. Levert
A. Camarena
Brian J. Daniels
J. Dunne
Tiffany Nguyen
T. A. Ramos
S. Thanawala
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