Old Web
English
Sign In
Acemap
>
authorDetail
>
J.H. Lim
J.H. Lim
KAIST
Materials science
Composite material
Moisture
Soldering
Fracture mechanics
1
Papers
9
Citations
0.00
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (1)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
Vapor pressure analysis of popcorn cracking in plastic IC packages by fracture mechanics
1998
EPTC | Electronics Packaging Technology Conference
J.H. Lim
K. W. Lee
S S Park
Y Y Earmme
Show All
Source
Cite
Save
Citations (9)
1