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Jens Warmuth
Jens Warmuth
Fraunhofer Society
Thermal resistance
Electronics
Electronic component
Electronic packaging
Computer science
3
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3
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0
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Failure Mechanism Detection Algorithm with MOSFET Body Diode
2021
EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Mohamad El Khatib
Sven Reitz
Jens Warmuth
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Thermal On-Board Spectroscopy: Thermal Impedance Simulation Using FEM and Thermal Modelling
2020
EuroSimE | International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems
Mohamad El Khatib
Sven Reitz
Jens Warmuth
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Reliability Testing and Stress Measurement of QFN Packages Encapsulated by an Open-Ended Microwave Curing System
2019
IEEE Transactions on Components, Packaging and Manufacturing Technology
Raphael Adamietz
Marc Phillipe Yves Desmulliez
Sumanth Kumar Pavuluri
T. Tilford
C. Bailey
Thomas Schreier-Alt
Jens Warmuth
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Citations (3)
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