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Seungjun Oh
Seungjun Oh
Sungkyunkwan University
Materials science
Chemical-mechanical planarization
Wafer
Abrasive
Particle-size distribution
5
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6
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0
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Butein-Enriched Fractions of Butea monosperma (Lam.) Taub. Flower Decrease Weight Gains and Increase Energy Expenditure in High-Fat Diet-Induced Obese Mice.
2021
Journal of Medicinal Food
Jaeyool Jang
Seo-Hyuk Chang
Dawoon Song
No-Joon Song
Saeroarum Han
Seungjun Oh
Ui Jeong Yun
Jee-Yin Ahn
Sukchan Lee
Jin Mo Ku
Kye Won Park
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Development of Eddy Current Sensor for Measuring Thickness of Copper Wafer in sub-Micron Scale
2021
Eungchul Kim
Seungjun Oh
Taesung Kim
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Investigation of Contaminants in Single Wafer Wet Cleaning Using Isopropyl Alcohol
2021
Solid State Phenomena
Seungjun Oh
Sunyoung Lee
Heehwan Kim
Donggeon Kwak
Chulwoo Bae
Taesung Kim
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Study on the effect of ceria concentration on the silicon oxide removal rate in chemical mechanical planarization
2020
Colloids and Surfaces A: Physicochemical and Engineering Aspects
Donggeon Kwak
Seungjun Oh
Juhwan Kim
Junho Yun
Taesung Kim
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Application of electrospray-scanning mobility particle sizer for the measurement of sub-10 nm chemical mechanical planarization slurry abrasive size distribution.
2020
Review of Scientific Instruments
Donggeon Kwak
Juhwan Kim
Seungjun Oh
Chulwoo Bae
Taesung Kim
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