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Tero Kangasvieri
Tero Kangasvieri
Nokia
Electronic engineering
Engineering
Soldering
Flange
Temperature cycling
3
Papers
1
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0
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Effect of voids on thermomechanical cracking in lead-free Sn3Ag0.5Cu interconnections of power modules
2020
Microelectronics Reliability
Juha Hagberg
O. Nousiainen
Jussi Putaala
Olli Salmela
Juha Raumanni
Matti Rahko
Tero Kangasvieri
Jussi Jaaskelainen
Timo Galkin
Heli Jantunen
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Power Module Interconnection Reliability in BTS applications
2019
IEEE Transactions on Device and Materials Reliability
Jussi Putaala
Juha Hagberg
Tero Kangasvieri
Juha Raumanni
Olli Salmela
Matti Rahko
Jussi Jaaskelainen
Timo Galkin
O. Nousiainen
Heli Jantunen
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Isolation optimization technique for 5G RF cavity
2017
CSCN | IEEE Conference on Standards for Communications and Networking
Muhammad Nazrul Islam
Lauri Hynynen
Mika Piiroinen
Tero Kangasvieri
Timo Tarvainen
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