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Mahesh Yalagach
Mahesh Yalagach
Materials science
Microelectromechanical systems
Mechanical engineering
Epoxy
Composite material
4
Papers
6
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Numerical analysis of a MEMS sensor's deformation behavior considering dynamic moisture conditions
2020
EPTC | Electronics Packaging Technology Conference
Mahesh Yalagach
Peter Filipp Fuchs
Thomas Antretter
Tao Qi
Markus Weber
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Numerical Analysis of the Influence of Polymeric Materials on a MEMS Package Performance Under Humidity and Temperature Loads
2019
ECTC | Electronic Components and Technology Conference
Mahesh Yalagach
Peter Filipp Fuchs
Archim Wolfberger
Mario Gschwandl
Thomas Antretter
Michael Feuchter
Coen Tak
Qi Tao
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Influence of environmental factors like temperature and humidity on MEMS packaging materials.
2018
Electronics System-integration Technology Conference
Mahesh Yalagach
Peter Filipp Fuchs
Ivaylo Mitev
Thomas Antretter
Michael Feuchter
Archim Wolfberger
Tao Qi
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Modeling of manufacturing induced residual stresses of viscoelastic epoxy mold compound encapsulations
2017
EPTC | Electronics Packaging Technology Conference
Mario Gschwandl
Peter Filipp Fuchs
Ivaylo Mitev
Mahesh Yalagach
Thomas Antretter
Tao Qi
Angelika Schingale
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Citations (3)
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