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Yekan Steven Wang
Yekan Steven Wang
Materials science
Thermal management of electronic devices and systems
Electronic engineering
Engineering physics
Diamond
4
Papers
2
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0
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(Invited) Materials Integration, Interlayers, and Interactions for Thermal Management of Wide Bandgap Device Structures
2021
Mark S. Goorsky
Michael E. Liao
Kenny Huynh
Yekan Steven Wang
Brandon Carson
Dorian Luccioni
Samuel Graham
William A. Doolittle
Patrick E. Hopkins
Asif Islam Khan
Marko J. Tadjer
Karl D. Hobart
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(Invited) Developments in Vertical GaN p-n Junction Structures Via p-Type Ion Implantation
2021
Mark S. Goorsky
Yekan Steven Wang
Michael E. Liao
Kenny Huynh
Travis J. Anderson
Karl D. Hobart
James Tweedie
Andrew A. Allerman
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Direct Wafer Bonding of GaN for Power Devices Applications
2018
Viorel Dragoi
Nasser Razek
Eric Guiot
Raphael Caulmilone
Michael Liao
Yekan Steven Wang
Mark S. Goorsky
Luke Yates
Samuel Graham
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Invited) Integration of Diamond with GaN for Thermal Management in High Power Applications
2018
Tingyu Bai
Mark S. Goorsky
Yekan Steven Wang
Tatyana I. Feygelson
Marko J Tadjer
Karl D Hobart
Samuel Graham
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