Old Web
English
Sign In
Acemap
>
authorDetail
>
Lois Liao Jinzhi
Lois Liao Jinzhi
Materials science
Wire bonding
Copper
Composite material
Analytical chemistry
3
Papers
1
Citations
0
KQI
Citation Trend
Filter By
Interval:
1900~2024
1900
2024
Author
Papers (3)
Sort By
Default
Most Recent
Most Early
Most Citation
No data
Journal
Conference
Others
A study on an abnormal oxidation issue of copper bonding wire
2019
IPFA | International Symposium on the Physical and Failure Analysis of Integrated Circuits
Lois Liao Jinzhi
Song Jianbo
Zhu Lei
Chen Yan
Cho Nan
Yao Qinghong
Fu Chao
Hua Younan
Li Xiaomin
Show All
Source
Cite
Save
Citations (0)
Comparison of Cl effect on Au-Al and Cu-Al HTS and bHAST wire bond reliability performance
2019
IPFA | International Symposium on the Physical and Failure Analysis of Integrated Circuits
Wang Bisheng
Lois Liao Jinzhi
Zhang Xi
Li Xiaomin
Hua Younan
Tee Weikok
Yee Boonhwa
Mao Songlin
Yao Qinghong
Show All
Source
Cite
Save
Citations (0)
A review on the copper bond pad application in wire bond technique
2018
ICEPT | International Conference on Electronic Packaging Technology
Lois Liao Jinzhi
Chen Yan
Wang Bisheng
Li Xiaomin
Fu Chao
Hua Younan
Show All
Source
Cite
Save
Citations (1)
1