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Tai Chong Chai

Agency for Science, Technology and Research

71

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Reliability life assessment and prediction for high density FOWLP package using finite element analysis and statistical approach

2021 ECTC | Electronic Components and Technology Conference
- Lin Ji
- Tai Chong Chai
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Laser drilling and Plasma Cleaning Process for Blind Via Through Mold Interconnect

2020 EPTC | Electronics Packaging Technology Conference
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Development of wafer level solderball placement process for RDL-first FOWLP

2020 EPTC | Electronics Packaging Technology Conference
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Study on Warpage and Reliability of Fan-Out Interposer Technology

2019 IEEE Transactions on Components, Packaging and Manufacturing Technology
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Development of WLCSP for Accelerometer Packaging with Vertical CuPd Wire as Through Mold Interconnection (TMI)

2018 ECTC | Electronic Components and Technology Conference
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Challenges and Approaches of 2.5D high density Flip chip interconnect on through mold interposer

2018 EPTC | Electronics Packaging Technology Conference
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Failure Mode and Mechanism Analysis for Cu Wire Bond on Cu/Low-k Chip by Wire Pull Test and Finite-Element Analysis

2018 IEEE Transactions on Device and Materials Reliability
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Thermal Design and Characterization of High Power SiC Inverter with Low Profile and Enhanced Thermal Performance

2018 ECTC | Electronic Components and Technology Conference
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Drop Impact Reliability Test and Failure Analysis for Large Size High Density FOWLP Package on Package

2017 ECTC | Electronic Components and Technology Conference
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Drop impact reliability study of high density fan-out wafer level package

2016 EPTC | Electronics Packaging Technology Conference
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