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Dan Beckett
Dan Beckett
Science and Technology Facilities Council
Materials science
Electrically conductive adhesive
Flexible electronics
Optoelectronics
Ball bonding
2
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1
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Thin Si Sensors on Flexible Printed Circuits – Study of Two Bond Methods
2021
EMPC | European Microelectronics and Packaging Conference
Andreas Schneider
Dan Beckett
Andrew Hill
Marcello Borri
Roy Lemmon
J. Lipp
Marielle Chartier
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Stencil Printing and Flip-Chip Bonding for Assembly of Pixelated X-ray Detectors using PCB-type Interposer and Flexible Printed Circuit Boards
2019
EMPC | European Microelectronics and Packaging Conference
Andreas Schneider
Simon P. Cross
Matthew D. Wilson
Matthew C. Veale
M. Hart
Paul Seller
Marcello Borri
Dan Beckett
J. Lipp
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