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Chin-Li Kao
Chin-Li Kao
Binghamton University
Electronic engineering
Engineering
Interposer
Digital image correlation
Mechanical engineering
4
Papers
88
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A Novel Speckle-Free Digital Image Correlation Method for In Situ Warpage Characterization
2017
IEEE Transactions on Components, Packaging and Manufacturing Technology
Yuling Niu
Shuai Shao
Seungbae Park
Chin-Li Kao
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Citations (13)
Prediction of deformation during manufacturing processes of silicon interposer package with TSVs
2016
Microelectronics Reliability
Yeonsung Kim
Ah-Young Park
Chin-Li Kao
Michael Z. Su
Bryan Black
Seungbae Park
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Citations (11)
An Overview of the Development of a GPU with Integrated HBM on Silicon Interposer
2016
ECTC | Electronic Components and Technology Conference
Chang Chi Lee
Cp Hung
Calvin Cheung
Ping-Feng Yang
Chin-Li Kao
Dao-Long Chen
Meng Kai Shih
Chien-Lin Chang Chien
Yu-Hsiang Hsiao
Li-chieh Chen
Michael Z. Su
Michael Alfano
Joe Siegel
Julius Din
Bryan Black
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Citations (63)
Warpage characterization analysis for Embedded package technology
2016
ICEP | International Conference on Electronics Packaging
Tang Yuan Chen
Meng Kai Shih
Ming-Hung Chen
Wei-Chung Chen
Shoji Uegaki
Chin-Li Kao
Ping-Feng Yang
Chin-Pin Hung
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Citations (1)
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