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C. N. Tung
C. N. Tung
Electron microprobe
Ceramic
Oxygen
Soldering
Copper
1
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Active Soldering of Indium Tin Oxide (ITO) With Cu in Air Using an Sn3.5Ag4Ti(Ce, Ga) Filler
2003
Journal of Materials Engineering and Performance
S. Y. Chang
L.-C. Tsao
M.J. Chiang
C. N. Tung
G. H. Pan
T. H. Chuang
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Citations (35)
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