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Jessica Dieguez
Jessica Dieguez
Scanning electron microscope
Materials science
Electronic engineering
Intermetallic
Microstructure
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Study of the Long Term Reliability of 3D IC under Near-Application Conditions
2018
ECTC | Electronic Components and Technology Conference
Omar Ahmed
Golareh Jalilvand
Jessica Dieguez
Peng Su
Tengfei Jiang
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