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J. Frömel
J. Frömel
Microelectromechanical systems
Materials science
Wafer bonding
Electronic engineering
Anodic bonding
4
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83
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0.01
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Wafer level encapsulation of microsystems using glass frit bonding
2006
Microsystem Technologies-micro-and Nanosystems-information Storage and Processing Systems
Roy Knechtel
M. Wiemer
J. Frömel
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Citations (69)
Room temperature vacuum sealing using surfaced activated bonding with Au thin films [microresonator example]
2005
TRANSDUCERS | International Conference on Solid-State Sensors, Actuators and Microsystems
Hironao Okada
Toshihiro Itoh
J. Frömel
T. Gessner
T. Suga
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Citations (10)
Bonding and contacting of MEMS-structures on wafer level
2003
Maik Wiemer
J. Frömel
C Jia
T. Gessner
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Citations (4)
Innenohr II: Hörsturz/Tinnitus
1993
B. Korves
S. Wolf
Ludger Klimek
J. Lamprecht
R. Hagen
P. Kraus
A. Utz
J. Frömel
C. Desloovere
R. Knecht
B. Rosemann
R. Schmidt
D. Bömer
G. Hoffmann
B. Böckler
F. Scheibe
Heidemarie Haupt
C. Ludwig
H Lutz
K. Jahnke
D. Höhmann
A. Philipp
F. Brassel
G Goebel
Wolfgang Hiller
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