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Rosie Johnson
Rosie Johnson
Chip-scale package
Electronic engineering
Wafer
Thermal copper pillar bump
Copper
2
Papers
7
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Workshop report: Intersecting identities—gender and intersectionality in physics
2019
Eden Hennessey
Joanne Cole
Prajval Shastri
Jessica Esquivel
Chandralekha Singh
Rosie Johnson
Shohini Ghose
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Citations (5)
High Density Copper Bump Technology Integrated With Wafer Level Package
2008
X. Zeng
Patty Chang-Chien
Chi Cheung
Gershon Akerling
Rosie Johnson
T. Chung
Kelly Hennig
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Citations (2)
1