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Mohsen Haji-Rahim
Mohsen Haji-Rahim
Flip chip
Materials science
Wafer dicing
Wafer
Dicing tape
2
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Study to Lower Cu Pillar Flip-Chip Failure Rate
2019
Bong Rosario
Joseph Holyoak
Mohsen Haji-Rahim
Gene Lambird
Yong Wang
Kendra Lyons
Todd Johnson
Paul Makowenskyj
Brian Myers
Shannon Pan
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Dicing Tape Evaluation for Wire-Bond and Bumped Flip Chip Wafer Applications
2013
Shannon Pan
Kent Li
Shannon Dang
Xing-Long Chen
Yalong Zhang
Kevin Liu
Bill Kopp
Mohsen Haji-Rahim
Waite Warren
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