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Kyunghag Jung
Kyunghag Jung
Samsung
Materials science
Composite material
Compression molding
Wafer-level packaging
Epoxy
2
Papers
11
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Improvement of package warpage through substrate and EMC optimization
2018
CSTIC | China Semiconductor Technology International Conference
Ken Lee
Min-Sung Kim
Jaesung Kim
Sang-Kyun Kim
Donghwan Lee
Kyunghag Jung
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Citations (2)
Compression Molding Encapsulants for Wafer-Level Embedded Active Devices: Wafer Warpage Control by Epoxy Molding Compounds
2017
ECTC | Electronic Components and Technology Conference
Kihyeok Kwon
Yoonman Lee
Junghwa Kim
Joo Young Chung
Kyunghag Jung
Yongyeop Park
Dong-Hwan Lee
Sang-Kyun Kim
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Citations (9)
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