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K.C. Yang
K.C. Yang
Chung-Ang University
Whisker
Whiskers
Composite material
Grain boundary
Metallurgy
3
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44
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Investigation of relation between intermetallic and tin whisker growths under ambient condition
2008
Microelectronics Reliability
Kwang-Soo Kim
C.H. Yu
Sung-Won Han
K.C. Yang
Jung Ha Kim
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Citations (39)
An Investigation on Wetting Characteristics of Solder Particle for Solderable Electrically Conductive Adhesives (ECAs)
2008
Materials Science Forum
Jong-Min Kim
K.C. Yang
Sung-Mok Lee
Seong Hyuk Lee
Young-Eui Shin
Kyong-Ho Chang
Jung-Geun Han
Yong-Sung Eom
Joohyun Moon
Jiwon Baek
Jae-Do Nam
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Citations (2)
Effects of postbake on the microstructure and whisker growth of matte Sn finish
2007
APMPPI | International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces
C.H. Yu
Hyunseo Kang
K. S. Kim
S.W. Han
K.C. Yang
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Citations (3)
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