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Antoine Chiteboun
Antoine Chiteboun
Thin film
Electronic circuit
Polishing
Electronic engineering
Wafer
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Patterned wafers backside thinning for 3-D Integration and multilayer stack achievement by direct wafer bonding
2008
MRS Proceedings
Barbara Charlet
Antoine Chiteboun
M. Zussy
Laurent Bally
P. Leduc
Myriam Assous
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