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T. Carden
T. Carden
IBM
Ceramic
Composite material
Soldering
Die (integrated circuit)
Flip chip
4
Papers
12
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Radiographic Properties of Plasma-Filled Rod-Pinch Diodes
2008
ICOPS | International Conference on Plasma Science
B.V. Weber
Raymond J. Allen
R. J. Commisso
G. Cooperstein
D.D. Hinshelwood
D. Mosher
D.P. Murphy
P. F. Ottinger
David G. Phipps
Joseph W. Schumer
Stavros J. Stephanakis
Stephen B. Swanekamp
Stuart C. Pope
J. Threadgold
Lester A. Biddle
Stephen G. Clough
A Jones
Mark A. Sinclair
D. Swatton
T. Carden
Bryan Velten Oliver
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Epoxy encapsulation on Ceramic Quad Flat Packs
1994
ECTC | Electronic Components and Technology Conference
T. Carden
J. Clementi
S. Engle
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Citations (6)
Epoxy encapsulation on ceramic quad flat packs (CQFPs)
1994
ECTC | Electronic Components and Technology Conference
J. Clementi
T. Carden
S. Engle
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Citations (5)
Epoxy encapsulation on ceramic quad flat packs (CQFP's)
1994
Electronic Components and Technology Conference
J. Clementi
T. Carden
S. Engle
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Citations (1)
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