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T. Buisson
T. Buisson
IMEC
Composite material
Materials science
Electronic engineering
Wafer-level packaging
Wafer
2
Papers
19
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Key elements for sub-50μm pitch micro bump processes
2013
ECTC | Electronic Components and Technology Conference
J. De Vos
Lieve Bogaerts
T. Buisson
C. Gerets
Geraldine Jamieson
Kevin Vandersmissen
A. La Manna
Eric Beyne
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Citations (15)
Integration challenges of Cu pillars with extreme wafer thinning for 3D stacking and packaging
2011
EPTC | Electronics Packaging Technology Conference
T. Buisson
G. Potoms
Alain Phommahaxay
G. Verbinnen
Patrick Jaenen
A. La Manna
Youssef Travaly
Eric Beyne
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Citations (4)
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