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Hsiu-Chi Chen

National Chiao Tung University

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Investigation and Optimization of Ultrathin Buffer Layers Used in Cu/Sn Eutectic Bonding

2018 IEEE Transactions on Components, Packaging and Manufacturing Technology
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Development and investigation of ultra-thin buffer layers used in symmetric Cu/Sn bonding and asymmetric Cu/Sn-Cu bonding for advanced 3D integration applications

2017 IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
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Asymmetry hybrid bonding using Cu/Sn bonding with polyimide for 3D heterogeneous integration applications

2017 IMPACT | International Microsystems, Packaging, Assembly and Circuits Technology Conference
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The influence of device morphology on wafer-level bonding with polymer-coated layer

2016 DIC | IEEE International D Systems Integration Conference
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