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O. Boillon
O. Boillon
Wafer dicing
Flatness (systems theory)
Die (manufacturing)
Stacking
Optoelectronics
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DEVELOPMENT OF AN ULTRA THIN DIE-TO-WAFER FLIP CHIP STACKING PROCESS FOR 2.5D INTEGRATION
2013
G. Pares
A. Attard
Franck Dosseul
A. N'hari
O. Boillon
L. Toffanin
G. Klug
G. Simon
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