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Sung-Dong Kim
Sung-Dong Kim
Seoul National University
Materials science
Soldering
Computer science
Artificial intelligence
Wafer-level packaging
5
Papers
42
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The Effects of UBM and SnAgCu Solder on Drop Impact Reliability of Wafer Level Package
2010
Hyun-Ho Kim
Do-Hyung Kim
Jong-Bin Kim
Hee-Jin Kim
Jae-Ung Ahn
In Soo Kang
Jun Kyu Lee
Hyo-Sok Ahn
Sung-Dong Kim
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Citations (2)
Reliability of Various Types of Wafer Level Package (WLP) for Mobile Application
2008
EPTC | Electronics Packaging Technology Conference
Gi Jo Jung
Yun-Mook Park
In Soo Kang
Byoung-Yool Jeon
Sung-Dong Kim
Hyo-Sok Ahn
Young-Jung Huh
Kyoung-Chul Jo
Gil Heo
Hee-Jun Park
Se-Ryoung Kim
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Citations (1)
Reliability ofVarious TypesofWaferLevel Package (WLP)forMobile Application
2008
Electronics Packaging Technology Conference
Gi Jo Jung
Yun-Mook Park
In Soo Kang
Byoung-Yool Jeon
Sung-Dong Kim
Hyo-Sok Ahn
Young-Jung Huh
Kyoung-Chul Jo
Hee-Jun Park
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Applying Machine Learning Techniques to Analysis of Gene Expression Data : Cancer Diagnosis
2002
Kyu-Baek Hwang
Dong-Yeon Cho
Sangwook Park
Sung-Dong Kim
Byoung-Tak Zhang
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Citations (39)
Machine Translation Systems: E-K, K-E, J-K, K-J
2000
AMTA | Conference of the Association for Machine Translation in the Americas
Yu Seop Kim
Sung-Dong Kim
Seong-Bae Park
Jong Woo Lee
Jeong Ho Chang
Kyu-Baek Hwang
Min O. Jang
Yung Taek Kim
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