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Wai Ling Lee
Wai Ling Lee
Altera
Electronic engineering
Field-programmable gate array
Embedded system
Engineering
Materials science
3
Papers
4
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0
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An innovative surrogate chip for accurate high-speed wire bond package measurement
2010
EPTC | Electronics Packaging Technology Conference
Hong Shi
Hoon Ngik Low
Xiaohong Jiang
Ying Fei Tan
Wai Ling Lee
Siow Chek Tan
Swee Fong Chong
John Xie
Ping Chet Tan
Loon Kwang Tan
Chong Poh Lim
Chiun Ning Liew
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Investigation to effectiveness of design factors for FPGA package PDN networks
2009
EPTC | Electronics Packaging Technology Conference
Wai Ling Lee
Hoon Ngik Low
Hong Shi
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Effective method to simulate Crosstalk between high density IO traces in high performance FPGA packages
2008
IEMT | International Electronics Manufacturing Technology Symposium
Wai Ling Lee
Hoon Ngik Low
Hong Shi
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