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Tingge Xu
Tingge Xu
Wafer dicing
Electronic engineering
Strain energy release rate
Delamination
Materials science
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Die Edge Crack Propagation Modeling for Risk Assessment of Advanced Technology Nodes
2018
ECTC | Electronic Components and Technology Conference
Tingge Xu
Zhuo-Jie Wu
Haojun Zhang
Carole Graas
Patrick Justison
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