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R. Ravikumar
R. Ravikumar
Siemens
Materials science
Electronic engineering
Back end of line
Dram
Integrated circuit layout
2
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2024
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Challenges of aluminum RIE technology at sub 0.45 /spl mu/m pitches [DRAM interconnects]
1999
IITC | International Interconnect Technology Conference
R. Ravikumar
Ronald G. Filippi
Roy C. Iggulden
Edward W. Kiewra
T. Kirihata
H. Kitahara
G.Y. Lee
B. Liegl
T. Matsunaga
X.J. Ning
David L. Rath
G. Stojakovic
Stefan J. Weber
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Influence of sidewall roughness on the reliability of 0.20-/spl mu/m Al RIE wiring
1999
IITC | International Interconnect Technology Conference
R. Ravikumar
H. Cichy
Ronald G. Filippi
Edward W. Kiewra
David L. Rath
G. Stojakovic
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