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Cong Tian
Cong Tian
Harbin Institute of Technology
Composite material
Electronics
Materials science
Thermal conductivity
Polyimide
2
Papers
8
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0
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Highly conductive thermal interface materials with vertically aligned graphite-nanoplatelet filler towards: High power density electronic device cooling
2021
Carbon
Xulei Wu
Huatao Wang
Ziao Wang
Jinglong Xu
Yajin Wu
Rui Xue
Hongxin Cui
Cong Tian
Yu Wang
Xiaoxiao Huang
Bo Zhong
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Flexible printed circuit board based on graphene/polyimide composites with excellent thermal conductivity and sandwich structure
2020
Composites Part A-applied Science and Manufacturing
Yu Wang
Huatao Wang
Fei Liu
Xulei Wu
Jinglong Xu
Hongxin Cui
Yajin Wu
Rui Xue
Cong Tian
Bojun Zheng
Wang Yao
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